this document is a general product description and is subject to change without notice. hynix do es not assume any responsibilit y for use of circuits described. no patent licenses are implied. rev. 0.2/ nov. 2005 1 preliminary hy27ug088g(2/5/d)m series 8gbit (1gx8bit) nand flash 8gb nand flash hy27ug088g2m hy27ug088g5m hy27ug088gdm
rev. 0.2 / nov. 2005 2 preliminary hy27ug088g(2/5/d)m series 8gbit (1gx8bit) nand flash document title 8gbit (1gx8bit) nand flash memory revision history revision no. history draft date remark 0.0 initial draft. sep. 08. 2005 initial 0.1 1) add hy27ug088g5m & hy27ug088gdm products. - texts & figures are added. 2) change ac characteristics 3) add tcrrh (100ns, min) - tcrrh: cache read re# high 4) change 3rd read id - 3rd read id is changed to c1h - 3rd byte of device identifier table is added. 5) change nop - number of partial program cycle in the same page is changed to 4. 6) delete concurrent operation. oct. 23. 2005 preliminary 0.2 1) change ac characteristics nov. 16. 2005 preliminary tr tar trea trhz tchz tcea before 20 10 18 30 30 25 after251520505035 tcls twp tds twc tadl trp trc before 12 12 12 25 70 12 25 after 15 15 15 30 100 15 30 trea tcea tcs before 20 35 20 after 25 30 25
rev. 0.2 / nov. 2005 3 preliminary hy27ug088g(2/5/d)m series 8gbit (1gx8bit) nand flash features summary high density nand flash memories - cost effective solutions for mass storage applications nand interface - x8 width. - multiplexed address/ data - pinout compatibility for all densities supply voltage - 3.3v device: vcc = 2.7 to 3.6v : hy27ug088g(2/5/d)m memory cell array = (2k+ 64) bytes x 64 pages x 8,192 blocks page size - x8 device : (2k + 64 spare) bytes : hy27ug088g(2/5/d)m block size - x8 device: (128k + 4k spare) bytes page read / program - random access: 25us (max.) - sequential access: 30ns (min.) - page program time: 200us (typ.) copy back program mode - fast page copy without external buffering cache program mode - internal cache register to improve the program throughput fast block erase - block erase time: 2ms (typ.) status register electronic signature - manufacturer code - device code chip enable don't care option - simple interface with microcontroller automatic page 0 read at power-up option - boot from nand support - automatic memory download serial number option hardware data protection - program/erase locked during power transitions data integrity - 100,000 program/erase cycles - 10 years data retention package - hy27ug088g2m-t(p) : 48-pin tsop1 (12 x 20 x 1.2 mm) - hy27ug088g2m-t (lead) - hy27ug088g2m-tp (lead free) - hy27ug088g5m-t(p) : 48-pin tsop1 (12 x 20 x 1.2 mm) - hy27ug088g5m-t (lead) - hy27ug088g5m-tp (lead free) - hy27ug088gdm-up :52- ulga (12 x 17 x 0.65 mm) - hy27ug088gdm-dp (lead free)
rev. 0.2 / nov. 2005 4 preliminary hy27ug088g(2/5/d)m series 8gbit (1gx8bit) nand flash 1. summary description the hynix hy27ug088g(2/5/d)m series is a 1gx8bit with spare 32mx8 bit capacity. the device is offered in 3.3v vcc power supply. its nand cell provides the most cost-effective solution for the solid state mass storage market. the memory is divided into blocks that can be erased indepe ndently so it is possible to preserve valid data while old data is erased. the device contains 8192 blocks, composed by 64 pages cons isting in two nand structures of 32 series connected flash cells. a program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 2ms on a 128k-byte(x8 device) block. data in the page mode can be read out at 30ns cycle time per byte. the i/o pins serve as the ports for address and data input/output as well as command input. this interface allows a reduced pin count and easy migration towards dif- ferent densities, without any rearrangement of footprint. commands, data and addresses are synchronously in troduced using ce#, we#, ale and cle input pin. the on-chip program/erase controller automates all progra m and erase functions including pulse repetition, where required, and internal verifica tion and margining of data. the modifying can be locked using the wp# input pin. the output pin rb# (open drain buffer) signals the status of the device during each operat ion. in a system with mul- tiple memories the rb# pins can be connected al l together to provide a global status signal. even the write-intensive systems can take advantage of the hy27ug088g(2/5/d)m extended reliability of 100k pro- gram/erase cycles by providing ecc (error correc ting code) with real time mapping-out algorithm. optionally the chip could be offered with the ce# don?t care function. this option allows the direct download of the code from the nand flash memory device by a microcontrol ler, since the ce# transitions do not stop the read opera- tion. the copy back function allows the opti mization of defective blocks management: when a page program operation fails the data can be directly programmed in another page inside the same array section withou t the time consuming serial data insertion phase. the cache program feature allows the data insertion in the ca che register while the data register is copied into the flash array. this pipelined program operation improves the program throughput when long files are written inside the memory. a cache read feature is also implemente d. this feature allows to dramatically improve the read throughput when con- secutive pages have to be streamed out. this device includes also extra features like otp/unique id area, block lock mechanism, automatic read at power up, read id2 extension. the hynix hy27ug088g(2/5/d)m series is available in 48 - tsop1 12 x 20 mm, 52-ulga 12 x 17 mm. 1.1 product list part number orization vcc range package hy27ug088g(2/5)m x8 2.7v - 3.6 volt 48tsop1 hy27ug088gdm x8 2.7v - 3.6 volt 52-ulga
rev. 0.2 / nov. 2005 5 preliminary hy27ug088g(2/5/d)m series 8gbit (1gx8bit) nand flash figure1: logic diagram 9 & |